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ROOT ▮ ENERGY-EFFICIENT AI BRANCH_1 OF ONE SPINE
TRACK 02 — FOR SAMSUNG · SK FOLKS

Compute belongs
inside memory.

The memory wall is the whole game for AI silicon. I've attacked it from three sides: RRAM-based compute-in-memory, dynamic adaptive on-chip memory management, and buffer-minimal accelerator dataflows — with two Samsung 28nm tape-outs along the way.

LIVE — MEMORY BANK ARRAY · ACCESS PATTERN + CIM MACS
CIM

I've fabricated compute-in-memory

SNN-based CIM MPW with RRAM synaptic circuits — PSpice-modeled neurons, fabricated synapse arrays, real measurements.

HIER

Memory hierarchy is my optimization target

S³A-NPU's headline contribution is dynamic adaptive memory optimization — published in IEEE TVLSI 2025.

28NM

Two Samsung 28nm tape-outs

HAB-1 (2024) and the sparsity transformer accelerator (2025) — I know the Samsung foundry flow from RTL to GDS.

MPW · 2023

SNN-based Compute-In-Memory with RRAM Synapses

Neuromorphic CIM architecture, PSpice neuron simulation, fabricated synaptic circuits

DEMO →
TVLSI 2025

S³A-NPU — Dynamic Adaptive Memory Optimization

On-chip memory management tuned at runtime to spiking SSL workload phases

PDF →
28NM ×2

Samsung 28nm Tape-outs — HAB-1 & Transformer Accelerator

Host-accelerator bridge with multi-channel MPI; sparsity-aware datapaths with MMIO control

DEMO →
ICCE 2023

Buffer Memory Reduction for Lane Detection on FPGA

Sliding-based parallel segment detection that cuts line-buffer requirements

PAPER →

Let's break the
memory wall together.

OPEN TO RESEARCH INTERNSHIPS — PIM / CIM / MEMORY SYSTEMS TEAMS